Insect barrier

ABSTRACT

An active barrier to termites and other insects includes a polymeric or paper substrate; and a copper-carbon matrix, wherein the copper-carbon matrix is incorporated into or is coated onto the polymeric or paper substrate. The resulting combination of the substrate and copper-carbon matrix allows for the creation of films, tapes, coated paper and fabric, or molded or formed parts that interfere with and block the passage or entry beyond the barrier of termites or other insects. Uses may be as diverse as but not limited to underlayment(s) for temporary, semi-permanent or permanent structures as well as films and barriers for walls, roofs of permanent, semi-permanent or temporary structures, or interior spaces, cabinets, or vehicles or protecting equipment, telecommunication gear, electronics or other assets that may be impacted, damaged or degraded by termite or other such insect infestation.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of priority under 35 U.S.C. §119(e)to U.S. Provisional Patent Application No. 62/081,978 titled “TermiteBarrier,” filed on Nov. 19, 2014, the entire disclosure of which ishereby incorporated by reference in its entirety for all purposes.

TECHNICAL FIELD OF THE INVENTION

The present disclosure relates to articles and compositions, methods ofsnaking the articles and compositions, and methods of using the articlesand compositions for suppressing and/or protecting against the intrusionof termites and/or other insects.

BACKGROUND OF THE INVENTION

Termites and termite infestation is an expensive and pervasive problem.Typically, chemicals or mesh screens are used to try to either killtermites or provide a physical barrier to prevent them from entering anarea. Termites are known to be attracted to electric fields of certainwavelengths, and devices have been prepared to emit the exactfrequencies and intensities required to manipulate termite behavior(see, U.S. Pat. Nos. 7,698,853 and 7,707,767). In addition, it is knownthat insects can accumulate an electric charge in flight when their bodyparts are moved or rubbed together, which may play a role in socialcommunication (see, Greggers U, Koch G, Schmidt V, Dürr A,Floriou-Servou A, Piepenbrock D, Göpfert M C, Menzel R., Reception andlearning of electric fields in bees, Proc. R. Soc. B. 20130528).However, there are limitations and/or potentially health and safetyissues with the various current systems.

Accordingly, there is a need in the art for new articles andcompositions for suppressing and/or protecting against the intrusion oftermites and/or other insects.

SUMMARY OF THE INVENTION

The present application provides articles, compositions, and methods forsuppressing and/or protecting against the intrusion of termites and/orother insects by use of an active barrier.

In various embodiments of the invention, methods and compositions areprovided in which electrical effects are used to suppress and/or protectagainst the intrusion of insects. In preferred embodiments, compositionsare used which form an active barrier to insect intrusion as a result ofthe electrical effects produced by those materials.

In one preferred embodiment, an active barrier is used which interfereswith the retransmission of communication signals among insects, causingthem to move away from the barrier. In one such embodiment, the barrierinterferes with insect communication by causing out of phaseretransmission of the insects' electrical communication signals, causingconfusion among the insects and causing them to move away from thematerial.

In a alternative or additional preferred embodiments, a triboelectriceffect (tribo-electric charging) is used to trouble insects and causethem to move away from a particular material and/or location. In onesuch preferred embodiment, methods are utilized in which an activebarrier is provided having a sufficiently low activation threshold suchthat tribo-electric charging when an insect moves along the barrier'ssurface generates voltages sufficiently high to trigger electricaltransients that will trouble the insect and cause it to move away.

Preferably, materials are provided producing the electrical effectsdescribed above, when an insect moves along or is in proximity to thematerial's surface.

In various preferred embodiments, the active barrier to termites and/orother insects includes: a polymeric or paper substrate; and acopper-carbon matrix, wherein the copper-carbon matrix is incorporatedinto and/or is coated onto the polymeric or paper substrate.

In various embodiments, the polymeric substrate may be a polyethylenebased polymer, a low-density polyethylene (LDPE) based polymer, a linearlow-density polyethylene (LLDPE) based polymer, a high-densitypolyethylene (HDPE) based polymer, a polypropylene (PP) based polymer, apolystyrene based polymer, a polyurethane based polymer, a polyacrylicbased polymer, a polyethylene terephthalate (PET) based polymer, or acombination thereof.

In embodiments, the polymeric substrate may be a blend of about 40% LDPEand about 60% LLDPE, or a combination thereof.

In embodiments, the copper-carbon matrix may include copper powder orcopper flake, and carbon black.

In embodiments, the copper-carbon matrix may include copper particleshaving an inner layer core of copper with a discontinuous outer layer ofcupric oxide (CuO) and/or cuprous oxide (Cu₂O).

In embodiments, the copper-carbon matrix may include copper particlesranging from about 0.5 microns to 70 microns in size; and from about 3%by weight to about 28% by weight of the copper-carbon matrix.

In embodiments, the copper-carbon matrix may include carbon black in aconcentration sufficient to achieve electro-static dissipative (ESD)levels of about 10⁴ to 10¹⁰ ohms/square.

In embodiments, the copper-carbon matrix may include carbon black fromabout 3% by weight to about 25% by weight of the copper-carbon matrix.

In embodiments, the active barrier may also include at least oneadditive in and/or on the polymeric or paper substrate and thecopper-carbon matrix for improving the insect repelling properties ofthe active barrier, wherein the at least one additive is an insecticidalcompound used to treat wood surfaces.

In embodiments, the active barrier may also include at least one inertpolymeric carrier, wherein the inert polymeric carrier is a convolutedsheet, a textured sheet, a film, a laminated structure, a paper, anadhesive tape, a non-adhesive tape, a fabric, a foam, a mesh, or anextrusion form or shape.

In embodiments, the active barrier may also include at least oneadhesive on at least one side of the active barrier to form a self-sticktape.

In embodiments, the active barrier may also include at least oneadditive selected from graphite particles and spheres, graphite coatedglass, carbon nano-particles, and amine and amide based anti-staticadditives.

In embodiments, the active barrier may also include at least oneadditive present in the active barrier in at least about 2% by weight ofthe active barrier.

In embodiments, the active barrier may act to prevent insects fromcrossing, eating, or penetrating through or into the polymeric or papersubstrate and copper-carbon matrix.

In embodiments, the active barrier may include an electrical activationthreshold of less than the tribo-electric charging of an insect movingover a surface of the barrier.

In embodiments, the active barrier may include an activation thresholdthat is inherently low enough to cause a transmission of spuriouselectrical transmissions as an insect moves onto a surface of thebarrier.

In other embodiments, the inventions provide methods for suppressingand/or protecting against intrusion of termites and other insects, bythe steps of: a) placing an active barrier adjacent to an area to besuppressed and/or protected, wherein the active barrier includes: apolymeric or paper substrate; and a copper-carbon matrix, wherein thecopper-carbon matrix is incorporated into or is coated onto thepolymeric or paper substrate; and b) allowing the termites and otherinsects to move over a surface of the active barrier, wherein theelectrical and physical properties of the active barrier suppressesand/or protects against intrusion of termites and other insects.

In embodiments, the active barrier used in the methods for suppressingand/or protecting against intrusion of termites and other insects mayalso include at least one adhesive on at least one side of the activebarrier to form a self-stick tape, wherein the active barrier is placedunder, around, above and/or inside the area.

In other embodiments, the inventions provide methods for preparing anactive barrier to termites and other insects, by the steps of: a)incorporating or coating a copper-carbon matrix into a polymeric orpaper substrate; b) placing the active barrier adjacent to an area to besuppressed and/or protected; and c) allowing the termites and otherinsects to move over a surface of the active barrier, wherein anelectrical activation threshold of the active barrier is less thantribo-electric charging of an insect moving over a surface of thebarrier, and wherein the activation threshold of the active barrier isinherently low enough to cause a transmission of spurious electricaltransmissions as the termites and other insects move onto the activebarrier thereby suppressing and/or protecting the area against theintrusion of termites and other insects.

In embodiments, the copper-carbon matrix used in the methods forpreparing the active barrier is incorporated into the polymeric or papersubstrate by pressing, mixing, or blending copper and carbon black intothe polymer or paper substrate; and/or by coating the polymer or papersubstrate with a suspension of copper and carbon black in a vehicle.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 provides an illustration of typical CMOS currents/collectorvoltages, and secondary transmissions of spurious electrical transientsgenerated by switching on a CMOS current/collector voltage according toan exemplary embodiment.

DETAILED DESCRIPTION OF THE INVENTION AND THE PREFERRED EMBODIMENTS

The present inventions provide articles, compositions and methods forthe suppression of and/or protection against the intrusion of termitesand/or other insects.

In various embodiments of the invention, electrical effects are used tosuppress and/or protect against the intrusion of insects. In preferredembodiments, materials are used which form an active barrier as a resultof the electrical effects produced by those materials.

In one preferred embodiment, an active barrier is used which interfereswith the retransmission of communication signals among insects, causingthem to move away from the barrier. In one such embodiment, the barrierinterferes with insect communication by causing out of phaseretransmission of the insects' electrical communication signals, causingconfusion among the insects and causing them to move away from thematerial.

In alternative or additional preferred embodiments, a triboelectriceffect (tribo-electric charging) is used to trouble insects and causethem to move away from a particular material and/or location. In onesuch preferred embodiment, methods are utilized in which an activebarrier is provided having a sufficiently low activation threshold suchthat tribo-electric charging when an insect moves along the barrier'ssurface generates voltages sufficiently high to trigger sufficientlyserious transients that will trouble the insect and cause it to moveaway.

In further embodiments, materials are provided producing the electricaleffects described above, when an insect moves along or is in proximityto the material's surface.

In various preferred embodiments, the inventions provide an activebather to termites and/or other insects having a polymeric or papersubstrate; and a copper-carbon matrix, wherein the copper-carbon matrixis incorporated into and/or is coated onto the polymeric or papersubstrate. In one such embodiment, the polymeric or paper substrate mayinclude an adhesive layer on at least one surface, for example, a backsurface, to form a self-stick tape. It has been found that thesematerials provide a barrier to termites and/or other insects to keepthem from crossing, eating or penetrating through or into the activebarrier.

In various of the embodiments, the inventions provide a polymericsubstrate, e.g. a plastic film, or a paper substrate, which includes acopper additive and a carbon matrix that has been incorporated intoand/or onto the substrate. In various embodiments, the inventionsprovide methods for preparing and utilizing these materials, filmsand/or tapes under, around, above and/or inside structures to keep thosestructures free from termites and/or other insects.

In preferred embodiments, the inventions provide a polymeric substrate,e.g., plastic film, or paper substrate or any other suitable material,which is either manufactured with and/or coated with materials thatchange the electrical and physical properties and nature of thesubstrate and/or materials in such a way that those propertiesdiscourage, inhibit or bar termites and/or other insects from wanting toeither cross, climb, bridge, self-sacrifice or chew through.

In preferred embodiments, the electrical and physical properties may bemodified such that the electrical activation threshold of the substrateand/or materials is less than the triboelectric charging of an insectmoving over a surface of the substrate and/or materials. In embodiments,the copper additive component may act as a CMOS (Copper Metal OxideSemiconductor), which transitions the substrate and/or materials frombeing electrically insulative to being able to electrically conduct orhave electric current flow through or across the substrate and/ormaterials. For example, the activation threshold may be inherently lowenough to cause a transmission of spurious electrical transmissions asthe termite and/or other insect moves onto a surface of the substrateand/or materials. The ensuing generation of spurious electricaltransients causes a disruption in the normal communications of thetermites and/or other insects, thus causing them to withdraw from thesurface by interfering with and/or disrupting the electricaltransmitting characteristics of the termite and/or other insects.

In various embodiments of the inventions, a copper additive may beincorporated into and/or is coated onto a polymeric substrate, e.g. aplastic film, or paper substrate to assist in increasing the barrierproperties of the original polymer or paper substrate, and to improveprotection against termites and/or other insects. Copper additives mayincrease the density of a polymeric or paper substrate by increasing thebarrier properties of the substrate, for example, by decreasing the gasand moisture permeation through the substrate. In accordance with thevarious embodiments, the bather properties provided may includesubstrates having in the range from about 1 to about 50%, or from about3% to about 40%, or from about 5% to 35%, or from about 32% copperadditive.

In various embodiments, a conductive material such as a highlyconductive carbon material may be associated with and/or bound to acopper additive to form a copper-carbon matrix in and/or on thepolymeric and paper substrates. For example, the copper-carbon matrixmay be formed in and/or on the substrate through the application of heatand/or pressure and reactions between the copper additive and carbonparticles. The resultant copper-carbon matrix product may exhibit anelectric surface resistance levels of about 10¹⁰ Ohms/square or less;for example, from about 10⁴ to about 10¹⁰ Ohms/square.

In embodiments, the combination of the copper component with aconductive material, such as carbon black, may be used to enhance thematerial's deterrent properties against termite or insect infestation.Or, as an alternative to a conductive carbon or carbon black, otheradditives such as surfactant-based chemistries may be used. In general,the additive (whether carbon black or otherwise) is utilized to impartto the material the ability to conduct or allow for the flow ofelectrons or electrical charge(s) from one copper particle to another,for example, a copper oxide coated copper core particle to another.

In addition, the combination of a copper additive and carbon blackmaterial may create a permanent change to the electrical properties ofthe material that the copper-carbon matrix is put into. The matrix beingadded to the material during extrusion, various molding operations orinjection or other plastic processes, or being added to plastic, paperor other substrates that may be coated or have a coating applied tothem.

In various preferred embodiments, the combination of a copper-carbonmatrix is provided to create a material that has an activation thresholdof less than about 1 volt. This activation threshold is the level atwhich an applied voltage will drive a semi-conductor material intoconduction (in this case a Copper Metal Oxide Semiconductor (CMOS)) frombeing insulative to being able to conduct or flow electrons orelectrical current. The injection of less than about 1 volt to thismatrix will turn the CMOS material on as it approaches voltages rangingfrom about 0.01 to 1.0 volts. The result of this switching generatessecondary transmissions of spurious electrical transients (see, FIG. 1)such as in a counter-EMF (electromotive force). This low activationthreshold allows the material to interfere or interrupt/interact withthe electrical communication transmissions of termites and other suchinsects.

In various embodiments, the combination of a copper-carbon matrix isprovided to create a material including but not limited to a film, whichacts as a semi-conductor device. The applied voltage level at which thematerial/film becomes able to flow electricity is about 0.7 volts. As itrelates to termites and/or other insects, when the voltage emitted bythe termite/insect communication reaches about 0.7 volts, thematerial/film becomes electrically active and re-transmits the voltagesignal, but due to the delay it is re-transmitted out of phase andincludes the switching transients. This out of phase re-transmission ofthe communication signal along with the transient signals interfere withthe communication that the termites and/or other insects have, making itimpossible for them to communicate and hence, acts as a pesticide devicediscouraging them from breaching the barrier material/film.

Either because of the inherent electrical properties of the film,coating or treated part, or its inherent electrical counter EMF fieldproduced by the treated film or substrate, the resulting materialprovides a barrier to termites. This barrier includes being able toprovide a layer that: termites choose not to, or are unable to chew intoor through; provides a surface that forces the insects to notself-sacrifice (a typical behavior of termites where the insect will doan activity which results in its death, but enables an area to bebreached or partially breached); that termites are not able to bridge(another behavior inherent in termites and ants that allows them toself-sacrifice to cross an area providing their bodies as a “bridge” toothers); and that termites do not attempt to cross even though there isa food source, or potential food source on the other side of thebarrier. Testing also showed that this created copper-carbon blackmatrix based film, coating, part or tape also discourages or stopstermites from wanting to climb vertically on the material in order totransit to a food source.

In various embodiments, the neutralization materials, being copper andcarbon black, may be physically or chemically suspended in a suitablevehicle, such as a polyurethane, and the suspension coated, for exampleby airless spraying or roller coating, into and/or onto the polymericand/or paper substrate. In other embodiments, copper and carbon blackmay be impressed, for example by a printing press or any other suitablemeans, into and/or onto the polymeric and/or paper substrate, or anyother surface to be protected. For example, copper and carbon black maybe inserted into and/or onto a carrier material such as a polymeric orpaper sheet, which may be used as a wrapping or liner for the interiorand/or exterior of an enclosure or structure for the item to beprotected.

For open unenclosed environments, an active bather may be applied to thearea to be protected as an entire underlayment where infestation isconsidered to be a high risk. Likewise, where there is a need to protectfrom infestation from above, the area may be covered with the disclosedactive barrier. In addition, the same polymeric and/or paper substratemay be modified with the copper-carbon matrix described herein may alsobe provided in the form of an adhesive or tacky or stretchy type of tapeto secure edges and/or other gaps that the substrate cannot easilyprotect, fill or cover.

In a further embodiment, the active barrier may include an ink orplastic material that uses an inert polymer carrier to hold theadditives of copper and carbon black. The inert carrier may be in sheet(convoluted or textured), film, laminated structures, paper, tape(adhesive and non-adhesive), fabric, foam, mesh, extrusions, or otherforms or shapes that offer a significant contact surface area to actualexternal area size or weight ratio.

In various embodiments, the copper additive is a copper powder or flake.Such materials, for example, may be produced by electro-deposition,atomization, by gaseous reduction of finely divided oxides,precipitation from solutions, or by sintering. In one embodiment, purecopper powder is used in flake form. Alternatively, flake powder may beused such as so-called “gold bronze” powders, produced from alloys ofcopper with zinc and aluminum.

In various embodiments, the copper particles have a core of copper witha discontinuous outer layer comprised of copper oxide in a mixedoxidation state of both cupric oxide (CuO) and cuprous oxide (Cu₂O). Forexample, an embodiment (which is not intended to be limiting) is copperpowder material produced by US Bronze.

Further, the copper particles utilized may range from about 0.5 micronsto about 70 microns in size. Alternatively, copper particles rangingfrom about 0.1 microns to about 100 microns may be used since thefunctionality of the copper is provided at any of these additive levels.

In various embodiments, the levels of copper additives utilized are inin the range from 3% by weight to 28% by weight of the copper-carbonmatrix. Alternatively, copper additives ranging from about 1% by weightto about 50% by weight, or from about 2% by weight to about 40% byweight, or from about 3% by weight to about 30% by weight of thecopper-carbon matrix may be used.

In a further embodiment, an additional additive is used in the polymer,along with the copper, to improve the insect repelling properties of thematerial. Such additives include but are not limited to insecticidalcompounds used to treat surfaces, specifically wood products, includingorganophosphorus insecticides such as phoxim and chloropyriphos, as wellas those classified in the pyrethroid series insecticides such aspermethrin, deltamethrin, cypermethrin, fenvalerate, and cyfluthrin.Additional insecticides include1-(6-chloro-3-pyridylmethyl)-2-nitromethylene-imidazolidine,3-(6-chloro-3-pyridylmethyl)-2-nitro-methylene-thiazolidine,1-(6-chloro-3-pyridylmethyl)-2-nitroimino-imidazolidine,1-(6-chloro-3-pyridylmethyl)-2-nitromethylene-tetrahydropyrimidine, and3-(6-chloro-3-pyridyl-methyl)-2-nitromethylene-tetrahydro-2H-1,3-thiazine.

In various embodiments, the further additive is carbon black. Theconcentration of the variety of carbon black used may be adjusted so asto achieve electro-static dissipative (ESD) levels of about 10⁴ to 10¹⁰ohms/Sq. For example, in an embodiment (which is not intended to belimiting) a conductive carbon black compound may be used from any numberof polymeric or plastic compounds domestically as well asinternationally.

Direct addition of conductive carbon black particles to an extruder isgenerally cumbersome, whereas the addition of pre-compounded conductivecarbon black particles in a low-density polyethylene (LDPE) or linearlow-density polyethylene (LLDPE) carrier (fractional melt up to 3 MI(melt index)) is ideal for manufacturing the plastic extruded film,sheets, foam, tape substrate and/or other materials that would functionas a physical barrier. Higher MIs are used for injection-moldedmaterials that can also be made into rigid barriers.

The carbon compound is blended together in the extruder with copperpowder, which is then incorporated into a polymeric substrate. Ideallythe subsequent compound will have ESD measurements between about 10³ and10¹⁰ ohms per square. This is achievable by the use of highly conductivecarbon black at levels of about 10-15% by weight of the copper-carbonmatrix, or generic carbon black with addition levels of about 15% to 25%by weight of the copper-carbon matrix.

In another embodiment, an electrically conductive carbon black isutilized that is in the range of about 3% to 15% by weight of thecopper-carbon matrix. Alternatively, carbon black ranging from about 1%to about 20% by weight of the copper-carbon matrix may be used.

Alternatively, instead of carbon black, other conductive carbons orother materials may be used as additives. In particular, additives areused that provide surfactant based chemistries that impart into amaterial the ability to conduct or allow for the flow of electrons orelectrical charge(s) from one copper oxide coated copper core particleto another. For example, graphite coated glass, graphite particles andspheres; carbon Nano-particles, amines and amide based anti-staticadditives (at addition levels of at least 2%) may be used.

With respect to the polymer, in accordance with one embodiment, thepolymer is a blend of LDPE/LLDPE. A blend of about 40% LDPE with about60% of LLDPE (Hexane) may be utilized to achieve desired physicalcharacteristics. Alternatively, a blend of about 30% LDPE with about 70%of LLDPE (Hexane) may be utilized. In addition, any other polyethylene,or polyethylene blend may be utilized. In particular, the actual blendcan vary depending on what strength and flexibility is required. Forexample, in further embodiments, other polymers may be used such asHDPE, PP, styrene, urethane, acrylic, or PET based polymers, or otherpolyolefin or polystyrene plastics may be used, or any combinations ofthese materials.

In various embodiments, the copper and carbon black materials may beincorporated into the polymeric or paper substrate by reactionsgenerated by the application of heat, pressure, and time in theextruder, under standard conditions used for extrusion of LDPE or LLDPEplastics. Specifically, the copper and carbon black compounds are mixedinto the extruder during the extrusion process. The copper, carbonblack, and polymeric or plastic compounds appear to engage in anexothermic reaction when the standard temperatures of extrusion arereached, which is believed to play a role in the ease of mixing of thecompounds together during the extrusion.

As a further example, any of the methods used in the Franey patent (U.S.Pat. No. 4,944,916) or the Donaldson patent (U.S. Pat. No. 6,593,007)may be used, both of which patents are fully incorporated herein byreference.

It should be appreciated that in various embodiments, the presentinventions provide an active barrier of a film, fabric, tape (with orwithout adhesives), foam, extrusion, formed parts or components orcoated parts, films or components, or any other suitable media or basethat uses a copper-carbon matrix (or other suitable matrix) in apolymeric or paper substrate to create a barrier to termite intrusionand/or the intrusion of other insects. In the tape embodiment, it shouldbe appreciated that the tape created can provide a way to seal holes,and/or to keep films or other substrates using the copper-carbon matrixtechnology secured down, and/or to provide a way to adhere the activebarrier to other surfaces, walls, structures, items or components.Alternatively, the materials used may be made into underlaymentmaterials for being put below houses, buildings, structures, orvehicles, whether these items are stationary, permanent orsemi-permanent, or transient.

The above description is considered that of certain embodiments of thepresent invention only. Modifications of the invention will occur tothose skilled in the art and to those who make or use the invention.Therefore it is understood that the embodiments described herein aremerely for illustrative purposes only and are not intended to limit thescope of the invention.

What is claimed is:
 1. An active barrier to termites and other insectscomprising: a polymeric or paper substrate; and a copper-carbon matrix,wherein the copper-carbon matrix is incorporated into or is coated ontothe polymeric or paper substrate.
 2. The active barrier of claim 1,wherein the polymeric substrate is a polyethylene based polymer, alow-density polyethylene (LDPE) based polymer, a linear low-densitypolyethylene (LLDPE) based polymer, a high-density polyethylene (HDPE)based polymer, a polypropylene (PP) based polymer, a polystyrene basedpolymer, a polyurethane based polymer, a polyacrylic based polymer, apolyethylene terephthalate (PET) based polymer, or a combinationthereof.
 3. The active barrier of claim 2, wherein the polymericsubstrate is a blend of about 40% LDPE and about 60% LLDPE.
 4. Theactive barrier of claim 1, wherein the copper-carbon matrix comprisescopper powder or copper flake, and carbon black.
 5. The active barrierof claim 1, wherein the copper-carbon matrix comprises copper particleshaving an inner layer core of copper with a discontinuous outer layer ofcupric oxide (CuO) and/or cuprous oxide (Cu₂O).
 6. The active barrier ofclaim 5, wherein the copper particles range from about 0.5 microns to 70microns in size; and from about 3% by weight to about 28% by weight ofthe copper-carbon matrix.
 7. The active barrier of claim 1, wherein thecopper-carbon matrix comprises carbon black in a concentrationsufficient to achieve electro-static dissipative (ESD) levels of about10⁴ to 10¹⁰ ohms/square.
 8. The active barrier of claim 7, wherein thecopper-carbon matrix comprises carbon black from about 3% by weight to25% by weight of the copper-carbon matrix.
 9. The active barrier ofclaim 1, further comprising at least one additive in and/or on thepolymeric or paper substrate and the copper-carbon matrix for improvingthe insect repelling properties of the active barrier, wherein the atleast one additive is an insecticidal compound used to treat woodsurfaces.
 10. The active barrier of claim 1, further comprising at leastone inert polymer carrier, wherein the inert carrier is a convolutedsheet, a textured sheet, a film, a laminated structure, a paper, anadhesive tape, a non-adhesive tape, a fabric, a foam, a mesh, or anextrusion form or shape.
 11. The active barrier of claim 1, furthercomprising at least one adhesive on at least one side of the activebarrier to form a self-stick tape.
 12. The active barrier of claim 1,further comprising at least one additive selected from graphiteparticles and spheres, graphite coated glass, and carbon nano-particles.13. The active barrier of claim 11, wherein the at least one additive ispresent in the active barrier in at least about 2% by weight of theactive barrier.
 14. The active barrier of claim 1, wherein the barrieracts to prevent insects from crossing, eating, or penetrating through orinto the polymeric or paper substrate and copper-carbon matrix.
 15. Theactive barrier of claim 1, wherein an electrical activation threshold ofthe active barrier is less than tribo-electric charging of an insectmoving over a surface of the barrier.
 16. The active barrier of claim15, wherein the activation threshold of the active barrier is inherentlylow enough to cause a transmission of spurious electrical transmissionsas an insect moves onto the active barrier.
 17. A method of suppressingand/or protecting against intrusion of termites and other insects, themethod comprising the steps of: a) placing an active barrier adjacent toan area to be suppressed and/or protected, wherein the active barriercomprises: a polymeric or paper substrate; and a copper-carbon matrix,wherein the copper-carbon matrix is incorporated into or is coated ontothe polymeric or paper substrate; and b) allowing the termites and otherinsects to move over a surface of the active barrier, wherein theelectrical and physical properties of the active barrier suppressesand/or protects against intrusion of termites and other insects.
 18. Themethod of claim 17, wherein the active barrier further comprises atleast one adhesive on at least one side of the active barrier to form aself-stick tape, wherein the active barrier is placed under, around,above and/or inside the area.
 19. A method of preparing an activebarrier to termites and other insects, the method comprising the stepsof: a) incorporating or coating a copper-carbon matrix into a polymericor paper substrate; b) placing the active barrier adjacent to an area tobe suppressed and/or protected; and c) allowing the termites and otherinsects to move over a surface of the active barrier, wherein anelectrical activation threshold of the active barrier is less thantribo-electric charging of an insect moving over a surface of thebarrier, and wherein the activation threshold of the active barrier isinherently low enough to cause a transmission of spurious electricaltransmissions as the termites and other insects move onto the activebarrier thereby suppressing and/or protecting the area against theintrusion of termites and other insects.
 20. The method of claim 19,wherein the copper-carbon matrix is incorporated into the polymeric orpaper substrate by pressing, mixing, or blending copper and carbon blackinto the polymer or paper substrate; and/or by coating the polymer orpaper substrate with a suspension of copper and carbon black in avehicle.